Release Highlights & Updates
Ansys 2024 R2 update revolutionizes the transition from multiphysics simulations to comprehensive multidisciplinary and multidomain workflows. By broadening the application of sophisticated numerical simulations across various engineering disciplines, we bridge the gap to deliver a complete digital engineering solution. Our unparalleled approach transforms intricate challenges into competitive advantages, establishing a new benchmark for a genuine multiphysics, multidomain engineering ecosystem.
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3D Design
Experience the latest enhancements in Ansys Discovery with our newest update.
Enjoy a dramatic increase in geometry modeling speed, enhanced simulation confidence, and the introduction of advanced GPU meshing for greater accuracy and reduced memory usage.
Model preparation is now ten times faster, with improved workflows and tools making complex tasks easier than ever.
Our cutting-edge GPU meshing technology ensures precise fluid simulations, optimizing the balance between detail capture and memory efficiency.
Additionally, automated bolt assessment and enhanced visualizations elevate simulation reliability, streamlining the design process for faster and better insights.
Additive
We are thrilled to announce the integration of Ansys’s cutting-edge simulation technology into Materialise Magics.
This strategic partnership is set to revolutionize metal additive manufacturing by enhancing product quality, reducing costs, and fostering innovation.
Through this collaboration, we can now effectively mitigate risks and predict and address part deformation and thermal stress at an early stage.
Autonomous Vehicle Simulation
The innovations in Ansys 2024 R2 significantly enhance our ability to meet the critical safety needs of our customers.
Key improvements in the sensor domain tackle the challenges of advanced radar digital twin IP protection for secure sharing and adaptive grid sampling for efficient long-range object detection.
AVxcelerate Autonomy introduces enhancements in the operation design domain (ODD) to enable more comprehensive scenario-based simulations, alongside multiple user interface improvements that expand the scope of ADAS/AD validation.
Connect
For superior multiphysics simulation, superior connectivity is essential.
The 2024 R2 update for the Connect collection enhances the tools needed to build top-tier multiphysics workflows with our Ansys solvers.
Ansys Connect provides the capabilities to swiftly create and publish new workflows, manage simulation and material data with traceability, and leverage robust AI-enabled optimization and analytics.
For complex systems, our Ansys Model-Based Systems Engineering (MBSE) solutions improve the accuracy, efficiency, and reliability of multiphysics simulations. MBSE provides clear, traceable links to simulation models, ensuring all relevant system requirements are met
Digital Missions Engineering
Ansys Digital Mission Engineering (DME) introduces exciting new capabilities designed to support systems engineers in multi-domain mission simulation and engineering analysis.
With the 2024 R2 release, we emphasize enhanced interoperability across the Ansys product portfolio, offering advanced system-level design and analysis, AI capabilities, and streamlined collaboration methods for enterprise-wide integration.
DME tools provide multi-domain mission modeling and simulation to meet the needs of cross-disciplined engineering teams and systems integrators, enabling consistent collaboration throughout the entire engineering lifecycle
Digital Twin
We are excited to introduce Ansys TwinAI, the latest addition to the Ansys Digital Twin product portfolio.
TwinAI seamlessly combines the precision of physics models with real-world data insights powered by advanced AI/ML techniques.
This innovative solution now supports Reduced Order Models (ROMs) and integrates Ansys Design Language, featuring new UI/UX enhancements.
Additionally, significant improvements in hybrid analytics, handling stateless FMUs, and ROM initialization further elevate the capabilities of Ansys TwinAI.
Electronics
Ansys Electronics continues to lead the way in computational electromagnetics and multiphysics simulations with the 2024 R2 release. This update includes:
- Innovative cooling methods and a new solution technique for electric machines
- A new EV powertrain design and simulation platform
- Enhanced solutions and workflows for designing consumer electronic devices
- A new product for chips-to-system design and advanced packaging/3DIC
- A new product for large-scale radar and wireless networks
- New mesh fusion for electrothermal analysis and improved mesh fusion performance for complex electromagnetics designs
Embedded Software
The latest release brings significant enhancements to safety-critical software development, particularly in SCADE Suite.
Notable updates include ARINC 661 compatibility updated to Supplement 9 and a new Python API for seamless programmatic connections between graphical panels and logic models.
Additionally, AUTOSAR code generation and modeling have achieved ISO 26262 ASIL D qualification.
SCADE Suite benefits from a new Extension Manager, while Scade One improves the user experience with features such as block alignment, easy duplication, and automatic test harness generation.
Fluids
Ansys Fluids 2024 R2 brings updates that enhance solver performance and introduce new capabilities for complex use cases.
The Fluent Multi-GPU Solver now supports AMD GPU cards, parametric studies, and expanded physics for new industry applications.
The Fluent Web Interface features new usability and productivity enhancements to improve the user experience.
Additionally, advancements in fluid multiphysics workflows include expanded integrations with Rocky, Mechanical, Thermal Desktop, and STK.
Materials
Continuing our focus on sustainable design, the 2024 R2 release introduces analysis and comparison of a Bill of Materials (BoM) to quickly assess the environmental impact of materials in different designs.
The Material Libraries have been expanded to include additional sustainability-focused, temperature-dependent, high-temperature alloy, polymer, and electromagnetic materials.
Granta MI users can now subscribe to their favorite materials list in MI Material Gateways, enhancing accessibility and usability.
Optics
Ansys Optics 2024 R2 bridges the gap between theoretical design and real-world application, ensuring systems can be designed, evaluated, and optimized with greater accuracy and reliability. Key features include:
- Streamlined data exchange from Ansys Zemax OpticStudio to Ansys Speos
- Enhanced tolerancing capabilities
- Improved light guide design for automotive lighting systems
- Enhanced workflows for photonic integrated circuits (PICs)
- Enhanced workflows for modern chip design
Safety Analysis
The improved collaboration server in the Ansys Safety Analysis product collection offers a powerful collaboration feature, enabling your team to work concurrently on the same project and streamline your safety-critical workflow.
Enhanced connectivity allows seamless import of models from various sources, such as Cameo and Codebeamer.
The beta version of the generic SysML importer, which loads SysML models based on scripts, opens up more possibilities.
Digital safety management (DSM) offers project templating with sophisticated updates, including project templates, nested hierarchies, and initial reports, all designed to boost team productivity and project efficiency.
Semiconductors
The semiconductor product line delivers significant advances in performance, speed, and capacity for advanced node chips, introducing new features for AMS design analysis and multi-die design’s thermal and multiphysics analysis. Key features include:
- The SigmaAV capability revolutionizes voltage drop signoff by offering comprehensive local and global noise coverage
- Reduced Order Models (ROM) enable a high-capacity analysis of chip and package systems with significantly reduced compute resources
- New multiphysics enablement with a thermal flow for integrated silicon photonics
- Ansys Totem-SC is 7x faster and offers 3x memory reduction
- Constraint checker in Ansys ParagonX enables systematic verification of parameters against specifications
Structures
The semiconductor product line delivers significant advances in performance, speed, and capacity for advanced node chips, introducing new features for AMS design analysis and multi-die design’s thermal and multiphysics analysis.
The SigmaAV capability revolutionizes voltage drop signoff by offering comprehensive local and global noise coverage. Reduced Order Models (ROM) enable a high-capacity analysis of chip and package systems with significantly reduced compute resources.
New multiphysics enablement with a thermal flow for integrated silicon photonics further enhances capabilities. Ansys Totem-SC is now 7x faster and offers 3x memory reduction.
Additionally, the constraint checker in Ansys ParagonX enables systematic verification of parameters against specifications.
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