Customer Projects

This article is authored by Ansys part of Synopsys and published in Ansys blog here.

While household appliances may seem to fade into the background as trusted staples of our everyday lives, the innovative design choices that enable them to achieve their goals and stand out in a highly competitive, multibillion-dollar industry are anything but banal.

Innovation takes flight when engineering meets Ansys simulation. That's exactly the approach adopted by Starbound.Project, a student team from the University of Thessaly, Greece, as they develop Daedalus 1.0 - a fully autonomous Vertical Take-Off and Landing (VTOL) unmanned aerial vehicle (UAV) designed for the UAS Challenge.

Space Photonics for high-speed satellite optical communications. Product development. High data rate Optical Transceivers (OTRx).

Asso Group has been actively involved in offshore and nearshore activities since its establishment in 1976. During its operation, Asso Subsea has maintained a cutting-edge technology-driven profile acting either as a turnkey solution provider or as a subcontractor to major cable installation companies and marine contractors.

THEON INTERNATIONAL is a highly flexible, medium-sized, European group of companies specializing in the development and manufacture of Electro-Optic Night Vision Systems and Thermal Imaging Devices for Defense and Security applications.

As the semiconductor industry continues to push toward higher performance and smaller devices, 3D integrated circuits (3D ICs) are becoming increasingly important. By stacking chips vertically, engineers can reduce interconnect lengths, improve speed, and lower power consumption.

The continuous demand for advanced technologies such as artificial intelligence, Internet of Things systems, autonomous vehicles, and high-performance computing has driven integrated circuits to operate at increasingly higher frequencies.

As traditional transistor scaling approaches its physical and economic limits, the semiconductor industry is increasingly turning to 3D integrated circuits (3D ICs) to extend Moore’s Law.

Rimac Technology took the stage at the recent Ansys Tech Day in Zagreb with a presentation on EMC simulations using Ansys Electronics Desktop.
Their session, “EMC Simulations in Ansys Electronics Desktop”, showcased use cases:
- High Voltage to Low Voltage (HVLV) coupling on a PCB.
- Optimization of PCB layout for large currents.
- Field analysis in a battery pack.